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MC74ACT241 Octal Buffer/Line Driver with 3-State Outputs
The MC74ACT241 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus oriented transmitter or receiver which provides improved PC board density.
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* 3-State Outputs Drive Bus Lines or Buffer Memory Address * * *
Registers Outputs Source/Sink 24 mA TTL Compatible Inputs Pb-Free Packages are Available
1 VCC 20 OE2 19 YA1 18 DB4 17 YA2 16 DB3 15 YA3 14 DB2 13 YA4 12 DB1 11 SOIC-20W DW SUFFIX CASE 751D
MARKING DIAGRAMS
20 ACT241 AWLYYWWG 1
20 1 OE1 2 DA1 3 YB4 4 DA2 5 YB3 6 DA3 7 YB2 8 DA4 9 YB1 10 GND 1 TSSOP-20 DT SUFFIX CASE 948E ACT 241 ALYWG G 1
Figure 1. Pinout: 20-Lead Packages Conductors
(Top View)
TRUTH TABLE
Inputs OE1 L L H D L H X Outputs (Pins 12, 14, 16, 18) L H Z 1 SOEIAJ-20 M SUFFIX CASE 967 1 20 74ACT241 AWLYWWG
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance
TRUTH TABLE
Inputs OE2 H H L D L H X Outputs (Pins 3, 5, 7, 9) L H Z
A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance
(c) Semiconductor Components Industries, LLC, 2006
1
December, 2006 - Rev. 5
Publication Order Number: MC74ACT241/D
MC74ACT241
MAXIMUM RATINGS
Symbol VCC VI VO IIK IOK IO ICC IGND TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage (Note 1) DC Input Diode Current DC Output Diode Current DC Output Sink/Source Current DC Supply Current per Output Pin DC Ground Current per Output Pin Storage Temperature Range Lead temperature, 1 mm from Case for 10 Seconds Junction temperature under Bias Thermal Resistance Power Dissipation in Still Air at 85_C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 30% - 35% Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Above VCC and Below GND at 85_C (Note 5) SOIC TSSOP SOIC TSSOP Parameter Value *0.5 to )7.0 *0.5 v VI v VCC )0.5 *0.5 v VO v VCC )0.5 $20 $50 $50 $50 $100 *65 to )150 260 )150 96 128 500 450 Level 1 UL 94 V-0 @ 0.125 in > 2000 > 200 > 1000 $100 V Unit V V V mA mA mA mA mA _C _C _C _C/W mW
ILatchup
Latchup Performance
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC Vin, Vout TA tr, tf IOH IOL Parameter DC Input Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Note 7) Output Current - High Output Current - Low VCC = 4.5 V VCC = 5.5 V Min 4.5 0 -40 0 0 - - 25 10 8.0 - - Typ Max 5.5 VCC +85 10 8.0 -24 24 Unit V V C ns/V mA mA
6. Unused Inputs may not be left open. All inputs must be tied to a high voltage level or low logic voltage level. 7. Vin from 0.8 V to 2.0 V; refer to individual Data Sheets for devices that differ from the typical input rise and fall times.
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MC74ACT241
DC CHARACTERISTICS
VCC (V) 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 VOL Maximum Low Level Output Voltage 4.5 5.5 4.5 5.5 IIN DICCT IOZ Maximum Input Leakage Current Additional Maximum ICC/Input Maximum 3-State Current 5.5 5.5 5.5 TA = +255C Typ 1.5 1.5 1.5 1.5 4.49 5.49 - 0.001 0.001 - - 0.6 - TA = -405C to +855C Unit V V V V V V V V V V V V mA mA mA Conditions VOUT = 0.1 V or VCC - 0.1 V VOUT = 0.1 V or VCC - 0.1 V IOUT = -50 mA *VIN = VIL or VIH IOH IOUT = 50 mA *VIN = VIL or VIH IOL VI = VCC, GND VI = VCC - 2.1 V VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND 24 mA 24 mA -24 mA -24 mA
Symbol VIH VIL VOH
Parameter Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage
Guaranteed Limits 2.0 2.0 0.8 0.8 4.4 5.4 3.86 4.86 0.1 0.1 0.36 0.36 0.1 - 0.5 2.0 2.0 0.8 0.8 4.4 5.4 3.76 4.76 0.1 0.1 0.44 0.44 1.0 1.5 5.0
IOLD IOHD ICC
Minimum Dynamic Output Current Maximum Quiescent Supply Current
5.5 5.5 5.5
- -
- 8.0
75 -75 80
mA mA mA
*All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS tr = tf = 3.0 ns (For Figures and Waveforms, See Figures 2, 3, and 4.)
TA = +255C CL = 50 pF Min 1.5 1.5 1.5 1.5 1.5 2.0 Typ 6.5 7.0 6.0 7.0 8.0 7.0 Max 9.0 9.0 9.0 10.0 10.5 10.5 TA = -405C to +855C CL = 50 pF Min 1.5 1.5 1.0 1.5 1.5 1.5 Max 10.0 10.0 10.0 11.0 11.5 11.5 Unit ns ns ns ns ns ns
Symbol tPLH tPHL tPZH tPZL tPHZ tPLZ
Parameter Propagation Delay Data to Output Propagation Delay Data to Output Output Enable Time Output Enable Time Output Disable Time Output Disable Time
VCC* (V) 5.0 5.0 5.0 5.0 5.0 5.0
*Voltage Range 5.0 V is 5.0 V 0.5 V
CAPACITANCE
Symbol CIN CPD Input Capacitance Power Dissipation Capacitance Parameter Value Typ 4.5 45 Unit pF pF Test Conditions VCC = 5.0 V VCC = 5.0 V
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MC74ACT241
SWITCHING WAVEFORMS
tr INPUT DATA 50% tw 1/fmax tPLH OUTPUT 50%
tf 3.0 V GND
tPHL
Figure 2.
3.0 V OE1 1.3 V GND 3.0 V OE2 1.3 V GND tPZL tPLZ OUTPUT Y (12, 14, 16, 18) 1.3 V 10% tPZH tPHZ OUTPUT Y (3, 5, 7, 9) 1.3 V 90% HIGH IMPEDANCE VOL VOH HIGH IMPEDANCE
Figure 3.
450 W INPUT OUTPUT DEVICE UNDER TEST 50 W SCOPE TEST POINT CL*
*Includes all probe and jig capacitance
Figure 4. Test Circuit
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MC74ACT241
ORDERING INFORMATION
Device MC74ACT241DW MC74ACT241DWG MC74ACT241DWR2 MC74ACT241DWR2G MC74ACT241DTR2 MC74ACT241DTR2G MC74ACT241MEL MC74ACT241MELG Package SOIC-20 SOIC-20 (Pb-Free) SOIC-20 SOIC-20 (Pb-Free) TSSOP-20* TSSOP-20* SOEIAJ-20 SOEIAJ-20 (Pb-Free) 2000 / Tape & Reel 2500 / Tape & Reel 1000 / Tape & Reel 38 Units / Rail Shipping
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These packages are inherently Pb-Free.
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MC74ACT241
PACKAGE DIMENSIONS
SOIC-20W DW SUFFIX CASE 751D-05 ISSUE G
D
A
11 X 45 _
q
H
M
B
M
20
10X
0.25
E
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_
1
10
20X
B 0.25
M
B TA
S
B
S
A
SEATING PLANE
h
18X
e
A1
T
C
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L
MC74ACT241
PACKAGE DIMENSIONS
TSSOP-20 DT SUFFIX CASE 948E-02 ISSUE C
K REF
M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 6.40 6.60 0.252 0.260 B 4.30 4.50 0.169 0.177 --- --- 0.047 C 1.20 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC -W- H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_
20X
2X
L/2
20
11
J J1 B -U- N
L
PIN 1 IDENT 1 10
0.15 (0.006) T U
S
A -V-
N F DETAIL E
C D 0.100 (0.004) -T- SEATING
PLANE
G
H
DETAIL E
SOLDERING FOOTPRINT*
7.06 1
16X
0.36
16X
1.26
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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IIII IIII IIII
SECTION N-N 0.25 (0.010) M
0.15 (0.006) T U
S
0.10 (0.004)
TU
S
V
S
K K1
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC74ACT241
PACKAGE DIMENSIONS
SOEIAJ-20 M SUFFIX CASE 967-01 ISSUE A
20
11
LE Q1 M_ L DETAIL P
E HE
1
10
Z D e VIEW P A
c
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.15 0.25 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.81 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.006 0.010 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.032
b 0.13 (0.005)
M
A1 0.10 (0.004)
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MC74ACT241/D

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